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  Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2014). Micromechanical investigation of lead-free solder joints in microelectronics. Talk presented at TMS 2014. San Diego, CA, USA. 2014-02-16 - 2014-02-20.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C367-D Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C36A-7
Genre: Talk

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 Creators:
Philippi, Bastian1, 2, Author              
Schießl, Andreas3, Author              
Schingale, Angelika3, Author              
Dehm, Gerhard1, Author              
Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22              
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22              

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Language(s): eng - English
 Dates: 2014
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: TMS 2014
Place of Event: San Diego, CA, USA
Start-/End Date: 2014-02-16 - 2014-02-20

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