Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, Bastian; Schießl, Andreas; Schingale, Angelika; Dehm, Gerhard

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Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2014). Micromechanical investigation of lead-free solder joints in microelectronics. Talk presented at TMS 2014. San Diego, CA, USA. 2014-02-16 - 2014-02-20.

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Datensatz-Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C367-D Versions-Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C36A-7

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Urheber:
Philippi, Bastian^{1, 2}, Autor
Schießl, Andreas³, Autor
Schingale, Angelika³, Autor
Dehm, Gerhard¹, Autor

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22