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  Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of lead-free solder joints in microelectronics. Poster presented at Small Scale Plasticity School, Cargèse, Korsika, France.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C35B-9 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C35C-7
Genre: Poster

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 Creators:
Philippi, Bastian1, 2, Author              
Schießl, Andreas3, Author              
Schingale, Angelika3, Author              
Dehm, Gerhard1, Author              
Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22              
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22              

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Language(s): eng - English
 Dates: 2013
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: Small Scale Plasticity School
Place of Event: Cargèse, Korsika, France
Start-/End Date: 2013-10-14 - 2013-10-18

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