Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, Bastian; Schießl, Andreas; Schingale, Angelika; Dehm, Gerhard

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Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of lead-free solder joints in microelectronics. Poster presented at Small Scale Plasticity School, Cargèse, Korsika, France.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C35B-9 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C35C-7

Genre: Poster

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Creators:
Philippi, Bastian^{1, 2}, Author
Schießl, Andreas³, Author
Schingale, Angelika³, Author
Dehm, Gerhard¹, Author

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22

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Language(s): eng - English

Dates: Created: 2013

Publication Status: Not specified

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Title: Small Scale Plasticity School

Place of Event: Cargèse, Korsika, France

Start-/End Date: 2013-10-14 - 2013-10-18

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