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  The role of silver in mitigation of whisker formation on thin tin films

Stein, J., Rehm, S., Welzel, U., Huegel, W., & Mittemeijer, E.-J. (2014). The role of silver in mitigation of whisker formation on thin tin films. Journal of Electronic Materials, 43, 4308-4316. doi:10.1007/s11664-014-3328-6.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-AFED-5 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-AFEE-3
Genre: Journal Article

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 Creators:
Stein, Jendrik1, 2, Author           
Rehm, Stefanie1, Author           
Welzel, Udo1, Author           
Huegel, W.2, Author
Mittemeijer, Eric-Jan1, 3, Author           
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Robert Bosch GmbH, ou_persistent22              
3Institut für Materialwissenschaft, Universität Stuttgart, ou_persistent22              

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Free keywords: Abt. Mittemeijer
 Abstract: -

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Language(s): eng - English
 Dates: 2014
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1007/s11664-014-3328-6
 Degree: -

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Title: Journal of Electronic Materials
  Other : J. Electron. Mater.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Warrendale, PA, etc. : Minerals, Metals & Materials Society and IEEE [etc.]
Pages: - Volume / Issue: 43 Sequence Number: - Start / End Page: 4308 - 4316 Identifier: ISSN: 0361-5235
CoNE: https://pure.mpg.de/cone/journals/resource/954925521690