Probing deformation mechanisms of Cu structures relevant for electronic 
applications

Dehm, Gerhard

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Probing deformation mechanisms of Cu structures relevant for electronic applications

Dehm, G. (2015). Probing deformation mechanisms of Cu structures relevant for electronic applications. Talk presented at Electronic Materials and Applications. Orlando, FL, USA. 2015-01-21 - 2015-01-23.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0025-89B5-0 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0025-AB9D-5

Genre: Talk

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Creators:
Dehm, Gerhard¹, Author

Affiliations:
1Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2015

Publication Status: Not specified

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Title: Electronic Materials and Applications

Place of Event: Orlando, FL, USA

Start-/End Date: 2015-01-21 - 2015-01-23

Invited: Yes

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