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  Ductile film delamination from compliant substrates using hard overlayers

Cordill, M. J., Marx, V. M., & Kirchlechner, C. (2014). Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films, 571(P2), 302-307. doi:10.1016/j.tsf.2014.02.093.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C731-3 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0029-AE11-E
Genre: Journal Article

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 Creators:
Cordill, Megan Jo1, Author              
Marx, Vera Maria2, Author              
Kirchlechner, Christoph3, Author              
Affiliations:
1Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22              
2Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399              
3Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              

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Language(s): eng - English
 Dates: 2014-11-28
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: DOI: 10.1016/j.tsf.2014.02.093
 Degree: -

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Title: Thin Solid Films
  Other : Thin Solid Films
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: 6 Volume / Issue: 571 (P2) Sequence Number: - Start / End Page: 302 - 307 Identifier: ISSN: 0040-6090
CoNE: https://pure.mpg.de/cone/journals/resource/null