Ductile film delamination from compliant substrates using hard overlayers

Cordill, Megan Jo; Marx, Vera Maria; Kirchlechner, Christoph

doi:10.1016/j.tsf.2014.02.093

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Ductile film delamination from compliant substrates using hard overlayers

Cordill, M. J., Marx, V. M., & Kirchlechner, C. (2014). Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films, 571(P2), 302-307. doi:10.1016/j.tsf.2014.02.093.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C731-3 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0029-AE11-E

Genre: Journal Article

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Creators:
Cordill, Megan Jo¹, Author
Marx, Vera Maria², Author
Kirchlechner, Christoph³, Author

Affiliations:
1Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22
2Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399
3Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401

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Language(s): eng - English

Dates: Date issued: 2014-11-28

Publication Status: Issued

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Identifiers: DOI: 10.1016/j.tsf.2014.02.093

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Title: Thin Solid Films

Other : Thin Solid Films

Source Genre: Journal

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Pages: 6 Volume / Issue: 571 (P2) Sequence Number: - Start / End Page: 302 - 307 Identifier: ISSN: 0040-6090
CoNE: https://pure.mpg.de/cone/journals/resource/null