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  Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates

Heinz, W., Robl, W., & Dehm, G. (2015). Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering, 137, 5-10. doi:10.1016/j.mee.2014.10.024.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0026-AD2B-4 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0028-2ECF-E
Genre: Journal Article

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 Creators:
Heinz, Walther1, Author              
Robl, Werner2, Author              
Dehm, Gerhard3, Author              
Affiliations:
1Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, A-9524 Villach, Austria, ou_persistent22              
2Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22              
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2014-11-072015
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: DOI: 10.1016/j.mee.2014.10.024
 Degree: -

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Title: Microelectronic Engineering
Source Genre: Journal
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Publ. Info: Amsterdam : Elsevier
Pages: - Volume / Issue: 137 Sequence Number: - Start / End Page: 5 - 10 Identifier: ISSN: 0167-9317
CoNE: https://pure.mpg.de/cone/journals/resource/954925484690