Subroutines for some plasma surface interaction processes: physical sputtering, 
chemical erosion, radiation enhanced sublimation, backscattering and thermal 
evaporation

Warrier, M.; Schneider, R.; Bonnin, X.

doi:10.1016/j.cpc.2004.02.011

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Subroutines for some plasma surface interaction processes: physical sputtering, chemical erosion, radiation enhanced sublimation, backscattering and thermal evaporation

Warrier, M., Schneider, R., & Bonnin, X. (2004). Subroutines for some plasma surface interaction processes: physical sputtering, chemical erosion, radiation enhanced sublimation, backscattering and thermal evaporation. Computer Physics Communications, 160, 46-68. doi:10.1016/j.cpc.2004.02.011.

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Datensatz-Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-1C71-9 Versions-Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-1C72-7

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Urheber:
Warrier, M.¹, Autor
Schneider, R.², Autor
Bonnin, X.¹, Autor

Affiliations:
1External Organizations, ou_persistent22
2Stellarator Theory (ST), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856287