Downscaling metal-dielectric interface fracture experiments to sub-micron 
dimensions: A feasibility study using TEM

Völker, Bernhard; Heinz, Walther; Roth, R.; Batke, Johann Markus; Cordill, Megan Jo; Dehm, Gerhard

doi:10.1016/j.surfcoat.2015.03.027

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Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM

Völker, B., Heinz, W., Roth, R., Batke, J. M., Cordill, M. J., & Dehm, G. (2015). Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM. Surface and Coatings Technology, 270, 1-7. doi:10.1016/j.surfcoat.2015.03.027.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0026-B3A8-0 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0026-B3AA-C

Genre: Journal Article

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Creators:
Völker, Bernhard^{1, 2}, Author
Heinz, Walther³, Author
Roth, R.⁴, Author
Batke, Johann Markus⁵, Author
Cordill, Megan Jo⁶, Author
Dehm, Gerhard⁷, Author

Affiliations:
1KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Technologiepark Villach, Europastrasse 8, 9524 Villach, Austria, ou_persistent22
2Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22
3Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, A-9524 Villach, Austria, ou_persistent22
4Infineon Technologies AG, 9500 Villach, Austria, ou_persistent22
5Infineon Technologies AG, 93049 Regensburg, Germany, ou_persistent22
6Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22
7Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Submitted: 2014-12-05Accepted: 2015-03-18Published Online: 2015-03-25Date issued: 2015-05-25

Publication Status: Issued

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Identifiers: DOI: 10.1016/j.surfcoat.2015.03.027

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Title: Surface and Coatings Technology

Abbreviation : Surf. Coat. Tech.

Source Genre: Journal

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Pages: - Volume / Issue: 270 Sequence Number: - Start / End Page: 1 - 7 Identifier: ISSN: 0257-8972
eSciDoc: http://pubman.mpdl.mpg.de/cone/journals/resource/954925496044