Mechanism of chemical erosion of sputter‐deposited C:H films

Schenk, A.; Biener, J.; Winter, B.; Lutterloh, C.; Schubert, U. A.; Küppers, J.

doi:10.1063/1.108182

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Mechanism of chemical erosion of sputter‐deposited C:H films

Schenk, A., Biener, J., Winter, B., Lutterloh, C., Schubert, U. A., & Küppers, J. (1992). Mechanism of chemical erosion of sputter‐deposited C:H films. Applied Physics Letters, 61(20), 2414-2416. doi:10.1063/1.108182.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-948E-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-948F-D

Genre: Journal Article

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Creators:
Schenk, A.¹, Author
Biener, J.¹, Author
Winter, B.¹, Author
Lutterloh, C.¹, Author
Schubert, U. A.², Author
Küppers, J.¹, Author

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1Surface Science (OP), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856288
2Max Planck Society, ou_persistent13

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Language(s): eng - English

Dates: Date issued: 1992

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 658196
DOI: 10.1063/1.108182
URI: http://apl.aip.org/resource/1/applab/v61/i20/p2414_s1

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Title: Applied Physics Letters

Source Genre: Journal

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Pages: - Volume / Issue: 61 (20) Sequence Number: - Start / End Page: 2414 - 2416 Identifier: -