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  Improving lead-free solders by resolving mechanical properties at the microstructure length scale

Philippi, B., Kirchlechner, C., Schießl, A., Schingale, A., & Dehm, G. (2014). Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Poster presented at Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0023-C731-3 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0027-C3B3-9
Genre: Poster

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 Creators:
Philippi, Bastian1, Author              
Kirchlechner, Christoph1, Author              
Schießl, Andreas2, Author              
Schingale, Angelika2, Author              
Dehm, Gerhard3, Author              
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22              
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2014
 Publication Status: Not specified
 Pages: -
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 Table of Contents: -
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference
Place of Event: Waltham, MA, USA
Start-/End Date: 2014-07-13 - 2014-07-18

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