Improving lead-free solders by resolving mechanical properties at the 
microstructure length scale

Philippi, Bastian; Kirchlechner, Christoph; Schießl, Andreas; Schingale, Angelika; Dehm, Gerhard

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Improving lead-free solders by resolving mechanical properties at the microstructure length scale

Philippi, B., Kirchlechner, C., Schießl, A., Schingale, A., & Dehm, G. (2014). Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Poster presented at Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C731-3 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-C3B3-9

Genre: Poster

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Creators:
Philippi, Bastian¹, Author
Kirchlechner, Christoph¹, Author
Schießl, Andreas², Author
Schingale, Angelika², Author
Dehm, Gerhard³, Author

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2014

Publication Status: Not specified

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Title: Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference

Place of Event: Waltham, MA, USA

Start-/End Date: 2014-07-13 - 2014-07-18

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