Encapsulated Silicene: A Robust Large-Gap Topological Insulator

Kou, Liangzhi; Ma, Yandong; Yan, Binghai; Tan, Xin; Chen, Changfeng; Smith, Sean C.

doi:10.1021/acsami.5b05063

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Encapsulated Silicene: A Robust Large-Gap Topological Insulator

Kou, L., Ma, Y., Yan, B., Tan, X., Chen, C., & Smith, S. C. (2015). Encapsulated Silicene: A Robust Large-Gap Topological Insulator. ACS Applied Materials and Interfaces, 7(34), 19226-19233. doi:10.1021/acsami.5b05063.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0028-9270-8 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-1807-D

Genre: Journal Article

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Creators:
Kou, Liangzhi¹, Author
Ma, Yandong¹, Author
Yan, Binghai², Author
Tan, Xin, Author
Chen, Changfeng¹, Author
Smith, Sean C.¹, Author

Affiliations:
1External Organizations, ou_persistent22
2Binghai Yan, Inorganic Chemistry, Max Planck Institute for Chemical Physics of Solids, Max Planck Society, ou_1863427

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Language(s): eng - English

Dates: Published Online: 2015-09-02Date issued: 2015-09-02

Publication Status: Issued

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Identifiers: ISI: 000360868700042
DOI: 10.1021/acsami.5b05063

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Title: ACS Applied Materials and Interfaces

Abbreviation : ACS Appl. Mater. Interfaces

Source Genre: Journal

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Publ. Info: Washington, DC : American Chemical Society

Pages: - Volume / Issue: 7 (34) Sequence Number: - Start / End Page: 19226 - 19233 Identifier: ISSN: 1944-8244
CoNE: https://pure.mpg.de/cone/journals/resource/1944-8244