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  Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures

Raghavan, R., Wheeler, J. M., Harzer, T. P., Chawla, V., Djaziri, S., Thomas, K. V., et al. (2015). Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia, 100, 73-80. doi:10.1016/j.actamat.2015.08.016.

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 Creators:
Raghavan, Rejin1, Author           
Wheeler, Jeffrey M.2, 3, Author           
Harzer, Tristan Philipp4, Author           
Chawla, Vipin2, Author           
Djaziri, Soundès4, Author           
Thomas, Kevin Victor2, Author           
Philippi, Bastian5, Author           
Kirchlechner, Christoph5, Author           
Jaya, Balila Nagamani5, Author           
Wehrs, Juri2, Author           
Michler, Johann2, Author           
Dehm, Gerhard6, Author           
Affiliations:
1Synthesis of Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863403              
2Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, Switzerland, ou_persistent22              
3Laboratory for Nanometallurgy, Department of Materials Science, ETH Zürich, Zurich, Switzerland, ou_persistent22              
4Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399              
5Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
6Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2015-11-01
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1016/j.actamat.2015.08.016
 Degree: -

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Title: Acta Materialia
  Abbreviation : Acta Mater.
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 100 Sequence Number: - Start / End Page: 73 - 80 Identifier: ISSN: 1359-6454
CoNE: https://pure.mpg.de/cone/journals/resource/954928603100