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  Crack patterns over uneven substrates.

Nandakishore, P., & Goehring, L. (2016). Crack patterns over uneven substrates. Soft Matter, 12(8), 2253-2263. doi:10.1039/c5sm02389k.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0029-BBA1-0 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-002D-3B81-A
Genre: Journal Article

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 Creators:
Nandakishore, Pawan1, Author              
Goehring, Lucas1, Author              
Affiliations:
1Group Pattern formation in the geosciences, Department of Dynamics of Complex Fluids, Max Planck Institute for Dynamics and Self-Organization, Max Planck Society, ou_2063304              

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 Abstract: Cracks in thin layers are influenced by what lies beneath them. From buried craters to crocodile skin, crack patterns are found over an enormous range of length scales. Regardless of absolute size, their substrates can dramatically influence how cracks form, guiding them in some cases, or shielding regions from them in others. Here we investigate how a substrate’s shape affects the appearance of cracks above it, by preparing mud cracks over sinusoidally varying surfaces. We find that as the thickness of the cracking layer increases, the observed crack patterns change from wavy to ladder-like to isotropic. Two order parameters are introduced to measure the relative alignment of these crack networks, and, along with Fourier methods, are used to characterise the transitions between crack pattern types. Finally, we explain these results with a model, based on the Griffith criteria of fracture, that identifies the conditions for which straight or wavy cracks will be seen, and predicts how well-ordered the cracks will be. Our metrics and results can be applied to any situation where connected networks of cracks are expected, or found.

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Language(s): eng - English
 Dates: 2016-01-062016-02-28
 Publication Status: Published in print
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 Rev. Method: Peer
 Identifiers: DOI: 10.1039/c5sm02389k
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Title: Soft Matter
Source Genre: Journal
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Pages: - Volume / Issue: 12 (8) Sequence Number: - Start / End Page: 2253 - 2263 Identifier: ISSN: 1744-683X