Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

Philippi, Bastian; Matoy, Kurt; Zechner, Johannes; Kirchlechner, Christoph; Dehm, Gerhard

doi:10.1016/j.scriptamat.2016.05.039

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Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics

Philippi, B., Matoy, K., Zechner, J., Kirchlechner, C., & Dehm, G. (2016). Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia, 123, 38-41. doi:10.1016/j.scriptamat.2016.05.039.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002D-96E8-7 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002D-96E9-5

Genre: Journal Article

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Creators:
Philippi, Bastian¹, Author
Matoy, Kurt², Author
Zechner, Johannes³, Author
Kirchlechner, Christoph^{1, 4}, Author
Dehm, Gerhard⁵, Author

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2Infineon Technologies AG Austria, Villach, Austria, ou_persistent22
3Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria, persistent22
4Department of Materials Physics, University of Leoben, Austrian Academy of Sciences, Austria, ou_persistent22
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Published Online: 2016-06-07Date issued: 2016-10

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1016/j.scriptamat.2016.05.039

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Title: Scripta Materialia

Source Genre: Journal

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Pages: - Volume / Issue: 123 Sequence Number: - Start / End Page: 38 - 41 Identifier: ISSN: 1359-6462
CoNE: https://pure.mpg.de/cone/journals/resource/954926243506