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  Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects

Philippi, B., Matoy, K., Zechner, J., Kirchlechner, C., & Dehm, G. (2017). Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials, 46(3), 1607-1611. doi:10.1007/s11664-016-5203-0.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-002D-A87D-A Version Permalink: http://hdl.handle.net/11858/00-001M-0000-002D-A87E-8
Genre: Journal Article

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 Creators:
Philippi, B.1, Author              
Matoy, Kurt2, Author              
Zechner, Johannes3, Author              
Kirchlechner, Christoph1, 4, Author              
Dehm, Gerhard5, Author              
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Infineon Technologies AG Austria, Villach, Austria, ou_persistent22              
3Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria, persistent22              
4Department of Materials Physics, University of Leoben, Austrian Academy of Sciences, Austria, ou_persistent22              
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2017-01-052017-03
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.1007/s11664-016-5203-0
 Degree: -

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Title: Journal of Electronic Materials
  Other : J. Electron. Mater.
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 46 (3) Sequence Number: - Start / End Page: 1607 - 1611 Identifier: ISSN: 0361-5235
CoNE: /journals/resource/954925521690