Grain boundary character distribution in electroplated nanotwinned copper

Ratanaphan, Sutatch; Raabe, Dierk; Sarochawikasit, Rajchawit; Olmsted, Davis L.; Rohrer, Gregory S.; Tu, Kingning

doi:10.1007/s10853-016-0670-5

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Grain boundary character distribution in electroplated nanotwinned copper

Ratanaphan, S., Raabe, D., Sarochawikasit, R., Olmsted, D. L., Rohrer, G. S., & Tu, K. (2017). Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science, 52(7), 4070-4085. doi:10.1007/s10853-016-0670-5.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002D-A82D-D Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002D-A82E-B

Genre: Journal Article

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Creators:
Ratanaphan, Sutatch¹, Author
Raabe, Dierk², Author
Sarochawikasit, Rajchawit³, Author
Olmsted, Davis L.⁴, Author
Rohrer, Gregory S.⁵, Author
Tu, Kingning⁶, Author

Affiliations:
1Department of Tool and Materials EngineeringKing Mongkut’s University of Technology ThonburiBangkokThailand, ou_persistent22
2Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381
3Department of Computer Engineering, King Mongkut’s University of Technology, Thonburi, Bangkok, Thailand, persistent22
4Department of Materials Science and Engineering ,University of California, Berkeley, CA, USA, persistent22
5Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, USA, persistent22
6Department of Materials Science and Engineering, University of California, Los Angeles, CA, USA, persistent22

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Language(s): eng - English

Dates: Published Online: 2016-12-22Date issued: 2017-04

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1007/s10853-016-0670-5

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Title: Journal of Materials Science

Abbreviation : JMS

Source Genre: Journal

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Pages: - Volume / Issue: 52 (7) Sequence Number: - Start / End Page: 4070 - 4085 Identifier: ISSN: 0022-2461
CoNE: https://pure.mpg.de/cone/journals/resource/954925415936_1