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  Grain boundary character distribution in electroplated nanotwinned copper

Ratanaphan, S., Raabe, D., Sarochawikasit, R., Olmsted, D. L., Rohrer, G. S., & Tu, K. (2017). Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science, 52(7), 4070-4085. doi:10.1007/s10853-016-0670-5.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-002D-A82D-D Version Permalink: http://hdl.handle.net/11858/00-001M-0000-002D-A82E-B
Genre: Journal Article

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 Creators:
Ratanaphan, Sutatch1, Author              
Raabe, Dierk2, Author              
Sarochawikasit, Rajchawit3, Author              
Olmsted, Davis L.4, Author              
Rohrer, Gregory S.5, Author              
Tu, Kingning6, Author              
Affiliations:
1Department of Tool and Materials EngineeringKing Mongkut’s University of Technology ThonburiBangkokThailand, ou_persistent22              
2Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381              
3Department of Computer Engineering, King Mongkut’s University of Technology, Thonburi, Bangkok, Thailand, persistent22              
4Department of Materials Science and Engineering ,University of California, Berkeley, CA, USA, persistent22              
5Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, USA, persistent22              
6Department of Materials Science and Engineering, University of California, Los Angeles, CA, USA, persistent22              

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Language(s): eng - English
 Dates: 2016-12-222017-04
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.1007/s10853-016-0670-5
 Degree: -

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Title: Journal of Materials Science
  Abbreviation : JMS
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 52 (7) Sequence Number: - Start / End Page: 4070 - 4085 Identifier: ISSN: 0022-2461
CoNE: /journals/resource/954925415936_1