English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature

Huang, R., Robl, W., Dehm, G., Ceric, H., & Detzel, T. (2010). Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 1-6). IEEE.

Item is

Basic

show hide
Item Permalink: http://hdl.handle.net/11858/00-001M-0000-002E-7D79-7 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-002E-7D7A-5
Genre: Conference Paper

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Huang, Rui1, Author              
Robl, Werner2, Author              
Dehm, Gerhard3, Author              
Ceric, Hajdin4, Author              
Detzel, Thomas5, Author              
Affiliations:
1Kompetenzzentrum Automobil-und Industrieelektronik (KAI) GmbH, Europastrasse 8, 9500 Villach, Austria, persistent22              
2Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22              
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
4Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, 1040 Vienna, Austria, persistent22              
5Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22              

Content

show

Details

show
hide
Language(s): eng - English
 Dates: 2010-07-29
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: DOI: 10.1109/IPFA.2010.5532222
 Degree: -

Event

show
hide
Title: International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010
Place of Event: Singapore, Singapore
Start-/End Date: 2010-07-05 - 2010-07-09

Legal Case

show

Project information

show

Source 1

show
hide
Title: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits
Source Genre: Proceedings
 Creator(s):
Affiliations:
Publ. Info: IEEE
Pages: - Volume / Issue: - Sequence Number: 5532222 Start / End Page: 1 - 6 Identifier: -