Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Gao, L.; Gstöttner, J.; Emling, R.; Linsmeier, Ch.; Balden, M.; Wiltner, A.; Hansch, W.; Schmitt-Landsiedel, D.

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Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Gao, L., Gstöttner, J., Emling, R., Linsmeier, C., Balden, M., Wiltner, A., et al. (2004). Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films. Talk presented at 2004 MRS Spring Meeting. San Francisco,CA. 2004-04-12 - 2004-04-16.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0000-07D7-6 Version Permalink: https://hdl.handle.net/21.11116/0000-0000-07D8-5

Genre: Talk

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Creators:
Gao, L.¹, Author
Gstöttner, J.², Author
Emling, R.², Author
Linsmeier, Ch.³, Author
Balden, M.³, Author
Wiltner, A.³, Author
Hansch, W.², Author
Schmitt-Landsiedel, D.², Author

Affiliations:
1External Organizations, ou_persistent22
2Institute for Technical Electronics, Technical University Munich, D-80333, Munich, Germany, ou_persistent22
3Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328

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Language(s): eng - English

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Identifiers: eDoc: 176086

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Title: 2004 MRS Spring Meeting

Place of Event: San Francisco,CA

Start-/End Date: 2004-04-12 - 2004-04-16

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