Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Gao, L.; Gstöttner, J.; Emling, R.; Linsmeier, Ch.; Balden, M.; Wiltner, A.; Hansch, W.; Schmitt-Landsiedel, D.

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Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Gao, L., Gstöttner, J., Emling, R., Linsmeier, C., Balden, M., Wiltner, A., et al. (2004). Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films. Talk presented at 2004 MRS Spring Meeting. San Francisco,CA. 2004-04-12 - 2004-04-16.

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Datensatz-Permalink: https://hdl.handle.net/21.11116/0000-0000-07D7-6 Versions-Permalink: https://hdl.handle.net/21.11116/0000-0000-07D8-5

Genre: Vortrag

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Urheber:
Gao, L.¹, Autor
Gstöttner, J.², Autor
Emling, R.², Autor
Linsmeier, Ch.³, Autor
Balden, M.³, Autor
Wiltner, A.³, Autor
Hansch, W.², Autor
Schmitt-Landsiedel, D.², Autor

Affiliations:
1External Organizations, ou_persistent22
2Institute for Technical Electronics, Technical University Munich, D-80333, Munich, Germany, ou_persistent22
3Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328