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  Copper/SiC Heat Sink Materials: Optimisation by Ttitanium as Coupling Agent

Pippel, E., Woltersdorf, J., Brendel, A., & Bolt, H.-H. (2005). Copper/SiC Heat Sink Materials: Optimisation by Ttitanium as Coupling Agent. Poster presented at European Congress on Advanced Materials and Processes (EUROMAT 2005), Prague.

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 Creators:
Pippel, E.1, Author           
Woltersdorf, J.2, Author
Brendel, A.1, Author           
Bolt, H.-H.2, Author
Affiliations:
1Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328              
2Max Planck Society, ou_persistent13              

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Language(s): eng - English
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 Publication Status: Not specified
 Pages: -
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 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 211449
 Degree: -

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Title: European Congress on Advanced Materials and Processes (EUROMAT 2005)
Place of Event: Prague
Start-/End Date: 2005-09-05 - 2005-09-08

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