Coating and microstructuring of tungsten fibers for enhanced interfacial 
adhesion in copper

Herrmann, A.; Balden, M.; Boswell, C.; Schmid, K.; Bolt, H.

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Coating and microstructuring of tungsten fibers for enhanced interfacial adhesion in copper

Herrmann, A., Balden, M., Boswell, C., Schmid, K., & Bolt, H. (2008). Coating and microstructuring of tungsten fibers for enhanced interfacial adhesion in copper. Poster presented at E-MRS 2008 Spring Meeting, Symposium N: Nuclear Materials, Strasbourg.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0000-222B-A Version Permalink: https://hdl.handle.net/21.11116/0000-0000-222C-9

Genre: Poster

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Creators:
Herrmann, A.¹, Author
Balden, M.², Author
Boswell, C.³, Author
Schmid, K.², Author
Bolt, H.², Author

Affiliations:
1Tokamak Scenario Development (E1), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856321
2Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328
3Department of Materials Science and Engineering, University of Florida, Gainswille FL 32605, United States, ou_persistent22

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Language(s): eng - English

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Publication Status: Not specified

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Identifiers: eDoc: 391581

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Title: E-MRS 2008 Spring Meeting, Symposium N: Nuclear Materials

Place of Event: Strasbourg

Start-/End Date: 2008-05-26 - 2008-05-30

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