A New Type of Dislocation Mechanism in Ultrathin Copper Films

Balk, Thomas John; Dehm, Gerhard; Arzt, Eduard

doi:10.1557/PROC-695-L2.7.1

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A New Type of Dislocation Mechanism in Ultrathin Copper Films

Balk, T. J., Dehm, G., & Arzt, E. (2002). A New Type of Dislocation Mechanism in Ultrathin Copper Films. In Materials Research Society Symposium - Proceedings (pp. 53-58). doi:10.1557/PROC-695-L2.7.1.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-8C6C-9 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-8C6F-6

Genre: Conference Paper

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Creators:
Balk, Thomas John¹, Author
Dehm, Gerhard¹, Author
Arzt, Eduard¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Language(s): eng - English

Dates: Published Online: 2011-03-21Date issued: 2002

Publication Status: Issued

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Identifiers: DOI: 10.1557/PROC-695-L2.7.1

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Title: Materials Research Society Symposium L - Thin Films: Stresses and Mechanical Properties IX

Place of Event: Boston, MA, USA

Start-/End Date: 2001-11-26 - 2001-11-30

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Title: Materials Research Society Symposium - Proceedings

Source Genre: Proceedings

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Pages: - Volume / Issue: 695 Sequence Number: - Start / End Page: 53 - 58 Identifier: -