In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a 
SiNx coated Si-substrate

Dehm, Gerhard; Arzt, Eduard

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In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substrate

Dehm, G., & Arzt, E. (2000). In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substrate. In F. Luděk (Ed.), Proceedings of the 12th European Congress on Electron Microscopy. Brno: Czechoslovak Society for Electron Microscopy.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-95EE-B Version Permalink: https://hdl.handle.net/21.11116/0000-0001-95F0-7

Genre: Conference Paper

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Creators:
Dehm, Gerhard¹, Author
Arzt, Eduard¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Language(s): eng - English

Dates: Date issued: 2000

Publication Status: Issued

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Title: 12th European Congress on Electron Microscopy (EUREM2000)

Place of Event: Brno, Czech Republic

Start-/End Date: 2000-07-09 - 2000-07-14

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Title: Proceedings of the 12th European Congress on Electron Microscopy

Source Genre: Proceedings

Creator(s):
Luděk , Frank, Editor

Affiliations:
-

Publ. Info: Brno : Czechoslovak Society for Electron Microscopy

Pages: 688 Volume / Issue: 2 Sequence Number: - Start / End Page: - Identifier: ISBN: 802385500X, 9788023855005