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  In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiNx coated Si-substrate

Dehm, G., & Arzt, E. (2000). In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiNx coated Si-substrate. In F. Luděk (Ed.), Proceedings of the 12th European Congress on Electron Microscopy. Brno: Czechoslovak Society for Electron Microscopy.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-95EE-B Version Permalink: http://hdl.handle.net/21.11116/0000-0001-95F0-7
Genre: Conference Paper

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 Creators:
Dehm, Gerhard1, Author              
Arzt, Eduard1, Author              
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              

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Language(s): eng - English
 Dates: 2000
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: 12th European Congress on Electron Microscopy (EUREM2000)
Place of Event: Brno, Czech Republic
Start-/End Date: 2000-07-09 - 2000-07-14

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Title: Proceedings of the 12th European Congress on Electron Microscopy
Source Genre: Proceedings
 Creator(s):
Luděk , Frank, Editor
Affiliations:
-
Publ. Info: Brno : Czechoslovak Society for Electron Microscopy
Pages: 688 Volume / Issue: 2 Sequence Number: - Start / End Page: - Identifier: ISBN: 802385500X, 9788023855005