Novel temperature dependent tensile test of freestanding copper thin film 
structures

Smolka, Martin; Motz, Christian; Detzel, Thomas; Robl, Werner; Grießer, Thomas; Wimmer, Alexander; Dehm, Gerhard

doi:10.1063/1.4725529

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Novel temperature dependent tensile test of freestanding copper thin film structures

Smolka, M., Motz, C., Detzel, T., Robl, W., Grießer, T., Wimmer, A., et al. (2012). Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments, 83(6): 064702. doi:10.1063/1.4725529.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-8BF4-F Version Permalink: https://hdl.handle.net/21.11116/0000-0001-8BF5-E

Genre: Journal Article

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Creators:
Smolka, Martin¹, Author
Motz, Christian², Author
Detzel, Thomas³, Author
Robl, Werner⁴, Author
Grießer, Thomas⁵, Author
Wimmer, Alexander¹, Author
Dehm, Gerhard^{2, 6}, Author

Affiliations:
1KAI Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, 9524 Villach, Austria, persistent22
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22
3Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22
4Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22
5Department of Chemistry and Polymeric Materials, University of Leoben, 8700 Leoben, Austria, persistent22
6Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22

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Language(s): eng - English

Dates: Date issued: 2012-06-06

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1063/1.4725529

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Title: Review of Scientific Instruments

Source Genre: Journal

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Pages: - Volume / Issue: 83 (6) Sequence Number: 064702 Start / End Page: - Identifier: ISSN: 0034-6748
CoNE: https://pure.mpg.de/cone/journals/resource/991042742033452