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  Novel temperature dependent tensile test of freestanding copper thin film structures

Smolka, M., Motz, C., Detzel, T., Robl, W., Grießer, T., Wimmer, A., et al. (2012). Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments, 83(6): 064702. doi:10.1063/1.4725529.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-8BF4-F Version Permalink: http://hdl.handle.net/21.11116/0000-0001-8BF5-E
Genre: Journal Article

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 Creators:
Smolka, Martin1, Author              
Motz, Christian2, Author              
Detzel, Thomas3, Author              
Robl, Werner4, Author              
Grießer, Thomas5, Author              
Wimmer, Alexander1, Author              
Dehm, Gerhard2, 6, Author              
Affiliations:
1KAI Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, 9524 Villach, Austria, persistent22              
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              
3Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22              
4Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22              
5Department of Chemistry and Polymeric Materials, University of Leoben, 8700 Leoben, Austria, persistent22              
6Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              

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Language(s): eng - English
 Dates: 2012-06-06
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.1063/1.4725529
 Degree: -

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Title: Review of Scientific Instruments
Source Genre: Journal
 Creator(s):
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Publ. Info: -
Pages: - Volume / Issue: 83 (6) Sequence Number: 064702 Start / End Page: - Identifier: ISSN: 0034-6748
CoNE: https://pure.mpg.de/cone/journals/resource/991042742033452