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  Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

Cordill, M. J., Taylor, A. A., Schalko, J., & Dehm, G. (2011). Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research, 102(6), 729-734. doi:10.3139/146.110513.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-9079-4 Version Permalink: http://hdl.handle.net/21.11116/0000-0001-9087-3
Genre: Journal Article

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 Creators:
Cordill, Megan Jo1, 2, Author              
Taylor, Aidan Arthur2, Author              
Schalko, Johannes3, Author              
Dehm, Gerhard4, 5, Author              
Affiliations:
1Department Materials Physics, Montanuniversitt Leoben, Jahnstrae 12, A-8700 Leoben, Austria, ou_persistent22              
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department Material Physics, University of Leoben, JahnstraGe 12, A-8700 Leoben, Austria, ou_persistent22              
3Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria, persistent22              
4Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
5Erich Schmid Institute of Material Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              

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Language(s): eng - English
 Dates: 2011-06
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.3139/146.110513
 Degree: -

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Title: International Journal of Materials Research
  Abbreviation : Int. J. Mat. Res.
Source Genre: Journal
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Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 102 (6) Sequence Number: - Start / End Page: 729 - 734 Identifier: ISSN: 1862-5282
CoNE: https://pure.mpg.de/cone/journals/resource/954925453910