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  Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions, 10(1), 47-54. doi:10.1109/TDMR.2009.2032768.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-94F7-1 Version Permalink: http://hdl.handle.net/21.11116/0000-0001-9502-4
Genre: Journal Article

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 Creators:
Huang, Rui1, 2, Author              
Robl, Werner3, Author              
Ceric, Hajdin4, Author              
Detzel, Thomas5, Author              
Dehm, Gerhard6, 7, Author              
Affiliations:
1Kompetenzzentrum Automobil-und Industrieelektronik (KAI) GmbH, Europastrasse 8, 9500 Villach, Austria, persistent22              
2Institute for Microelectronics, Technische Universität Wien, 1040 Vienna, Austria, persistent22              
3Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22              
4Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, 1040 Vienna, Austria, persistent22              
5Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22              
6Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
7Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              

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Language(s): eng - English
 Dates: 2009-09-222010-03
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.1109/TDMR.2009.2032768
 Degree: -

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Title: IEEE Transactions
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 10 (1) Sequence Number: - Start / End Page: 47 - 54 Identifier: -