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  Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests

Jörg, T., Cordill, M. J., Franz, R., Kirchlechner, C., Többens, D. M., Winkler, J., et al. (2017). Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing, 697, 17-23. doi:10.1016/j.msea.2017.04.101.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-64F1-E Version Permalink: http://hdl.handle.net/21.11116/0000-0001-6E88-B
Genre: Journal Article

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 Creators:
Jörg, Tanja1, Author              
Cordill, Megan Jo2, Author              
Franz, Robert3, Author              
Kirchlechner, Christoph4, 5, Author              
Többens, Daniel Maria6, Author              
Winkler, Jörg7, Author              
Mitterer, Christian8, Author              
Affiliations:
1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, A-8700 Leoben, Austria, persistent22              
2Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22              
3Department of Physical Metallurgy and Materials Testing, Montanuniversität Leoben, Franz-Josef-Strasse 18, Leoben, Austria, persistent22              
4Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
5Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              
6Helmholtz-Zentrum Berlin für Materialien und Energie, Albert-Einstein-Str. 15, 12489 Berlin, Germany, ou_persistent22              
7Business Unit Coating, PLANSEE SE, Metallwerk-Plansee-Strasse 71, Reutte, Austria, persistent22              
8Department of Physical Metallurgy and Materials Testing, Christian-Doppler Laboratory for Advanced Coatings, University of Leoben, Austria, ou_persistent22              

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Free keywords: ELECTRICAL-RESISTIVITY; POLYCRYSTALLINE FILMS; MOLYBDENUM FILMS; CU FILMS; SIZE; FRAGMENTATION; ADHESION; MODEL; STRESS; MICROSTRUCTUREScience & Technology - Other Topics; Materials Science; Metallurgy & Metallurgical Engineering; Thin films; Flexible substrates; Synchrotron diffraction; Electrical resistance; Adhesion;
 Abstract: The in situ characterization of the deformation and fracture behavior of brittle metal films is of great technological interest for many modern applications. A prominent example is the field of flexible electronics, which rely on the electrical and mechanical integrity of metal thin films on compliant substrates when exposed to straining or bending. Within this work, failure mechanisms, such as cracking and buckling, were studied as a function of film thickness and correlated with the elastic-plastic material response during straining. Mo thin films were synthesized with thicknesses between 40 and 500 nm on polyimide substrates using an industrial scale in-line direct current magnetron sputtering system. In situ synchrotron X-ray diffraction was employed to determine the evolution of lattice strain and film stress during uniaxial tensile straining while simultaneously measuring the change in electrical resistance. The results highlight that the electro-mechanical properties of Mo thin films scale with the film thickness. In general, a significant increase in fracture strength was observed with decreasing film thickness. Thus thinner Mo films were able to withstand higher tensile strains before cracking. In contrast, the 40 nm thick Mo film was the earliest to show delamination in the form of buckles, but the applied tensile strain of 12% was not high enough to induce buckling in the 500 nm thick Mo film. A model based on film buckling under uniaxial tensile tests was used to assess the interfacial adhesion energy between the Mo films and the polyimide substrates yielding values between 11 +/- 1 and 14 +/- 5 J/m(2).

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Language(s): eng - English
 Dates: 2017-06-14
 Publication Status: Published in print
 Pages: 7
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Degree: -

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Title: Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing
  Abbreviation : Mater. Sci. Eng. A: Struct. Mater. Prop. Microstruct. Process.
Source Genre: Journal
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Affiliations:
Publ. Info: New York, NY : Elsevier
Pages: - Volume / Issue: 697 Sequence Number: - Start / End Page: 17 - 23 Identifier: ISSN: 0921-5093
CoNE: /journals/resource/954928498465_1