English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Electrochemical migration of Sn and Sn solder alloys: a review

Zhong, X., Chen, L., Medgyes, B., Zhang, Z., Gao, S., & Jakab, L. (2017). Electrochemical migration of Sn and Sn solder alloys: a review. RSC Advances, 7(45), 28186-28206. doi:10.1039/c7ra04368f.

Item is

Basic

show hide
Item Permalink: http://hdl.handle.net/21.11116/0000-0001-71AE-C Version Permalink: http://hdl.handle.net/21.11116/0000-0001-71AF-B
Genre: Journal Article

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Zhong, Xiankang1, 2, Author              
Chen, Longjun2, Author              
Medgyes, Bálint3, Author              
Zhang, Zhi2, Author              
Gao, Shujun4, Author              
Jakab, László3, Author              
Affiliations:
1Corrosion, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_2074315              
2State Key Laboratory of Oil and Gas Reservoir Geology and Exploitation, School of Oil and Natural Gas Engineering, Southwest Petroleum University, Chengdu, China, persistent22              
3Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary, persistent22              
4Department of Chemical and Biomolecular Engineering, Ohio University, OH, USA, persistent22              

Content

show
hide
Free keywords: THIN ELECTROLYTE LAYERS; PRINTED-CIRCUIT BOARD; SURFACE INSULATION RESISTANCE; NO-CLEAN FLUX; LEAD-FREE SOLDERS; CHLORIDE-IONS; ATMOSPHERIC CORROSION; MECHANICAL-PROPERTIES; DENDRITE GROWTH; IN-SITUChemistry;
 Abstract: Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

Details

show
hide
Language(s): eng - English
 Dates: 2017
 Publication Status: Published in print
 Pages: 21
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: ISI: 000402999300038
DOI: 10.1039/c7ra04368f
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: RSC Advances
  Abbreviation : RSC Adv.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Cambridge, UK : Royal Society of Chemistry
Pages: - Volume / Issue: 7 (45) Sequence Number: - Start / End Page: 28186 - 28206 Identifier: ISSN: 2046-2069
CoNE: https://pure.mpg.de/cone/journals/resource/2046-2069