Influence of tantalum and silver interlayers on thermal stress evolution in 
copper thin films on silicon substrates

Schmidt, Tobias; Balk, Thomas John; Dehm, Gerhard; Arzt, Eduard

doi:10.1016/j.scriptamat.2003.11.039

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Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

Schmidt, T., Balk, T. J., Dehm, G., & Arzt, E. (2004). Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia, 50(6), 733-737. doi:10.1016/j.scriptamat.2003.11.039.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-97F0-5 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-97F1-4

Genre: Journal Article

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Creators:
Schmidt, Tobias¹, Author
Balk, Thomas John¹, Author
Dehm, Gerhard¹, Author
Arzt, Eduard¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Free keywords: MPI für Metallforschung; Abt. Arzt;

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Language(s): eng - English

Dates: Date issued: 2004-03

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 240275
DOI: 10.1016/j.scriptamat.2003.11.039

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Title: Scripta Materialia

Source Genre: Journal

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Publ. Info: Amsterdam : Elsevier B. V.

Pages: - Volume / Issue: 50 (6) Sequence Number: - Start / End Page: 733 - 737 Identifier: ISSN: 1359-6462
CoNE: https://pure.mpg.de/cone/journals/resource/954926243506