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  In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

Dehm, G., Weiss, D., & Arzt, E. (2001). In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing, 309-310, 468-472. doi:10.1016/S0921-5093(00)01703-2.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-9600-5 Version Permalink: http://hdl.handle.net/21.11116/0000-0001-9601-4
Genre: Journal Article

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 Creators:
Dehm, Gerhard1, Author              
Weiss, Dirk1, Author              
Arzt, Eduard1, 2, Author              
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; thin film plasticity; dislocation; interface; in situ TEM; thermal stress; Cu film
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Language(s): eng - English
 Dates: 2001-07-15
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: eDoc: 21054
ISI: 000169044600093
DOI: 10.1016/S0921-5093(00)01703-2
 Degree: -

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Title: Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing
  Abbreviation : Mater. Sci. Eng. A: Struct. Mater. Prop. Microstruct. Process.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: New York, NY : Elsevier
Pages: - Volume / Issue: 309-310 Sequence Number: - Start / End Page: 468 - 472 Identifier: ISSN: 0921-5093
CoNE: /journals/resource/954928498465_1