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  Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder

Du, C., Soler, R., Matoy, K., Zechner, J., Langer, G., Kirchlechner, C., et al. (2018). Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. Talk presented at European solid mechanics conference (ESMC) 2018. Bologna, Italy. 2018-07-02 - 2018-07-06.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-D819-0 Version Permalink: http://hdl.handle.net/21.11116/0000-0001-D81B-E
Genre: Talk

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 Creators:
Du, Chaowei1, Author              
Soler, Rafael1, Author              
Matoy, Kurt2, Author              
Zechner, Johannes3, Author              
Langer, Gregor4, Author              
Kirchlechner, Christoph1, Author              
Dehm, Gerhard5, Author              
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Infineon Technologies AG Austria, Villach, Austria, ou_persistent22              
3Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria, persistent22              
4Infineon Technologies AG Austria, Villach, Austria, persistent22              
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2018-07
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: European solid mechanics conference (ESMC) 2018
Place of Event: Bologna, Italy
Start-/End Date: 2018-07-02 - 2018-07-06

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