Pathways for reliable lead-free solder joints: micro-fracture properties of 
Au-Sn based solder

Du, Chaowei; Soler, Rafael; Matoy, Kurt; Zechner, Johannes; Langer, Gregor; Kirchlechner, Christoph; Dehm, Gerhard

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Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder

Du, C., Soler, R., Matoy, K., Zechner, J., Langer, G., Kirchlechner, C., et al. (2018). Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. Talk presented at European solid mechanics conference (ESMC) 2018. Bologna, Italy. 2018-07-02 - 2018-07-06.

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Datensatz-Permalink: https://hdl.handle.net/21.11116/0000-0001-D819-0 Versions-Permalink: https://hdl.handle.net/21.11116/0000-0001-D81B-E

Genre: Vortrag

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Urheber:
Du, Chaowei¹, Autor
Soler, Rafael¹, Autor
Matoy, Kurt², Autor
Zechner, Johannes³, Autor
Langer, Gregor⁴, Autor
Kirchlechner, Christoph¹, Autor
Dehm, Gerhard⁵, Autor

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2Infineon Technologies AG Austria, Villach, Austria, ou_persistent22
3Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria, persistent22
4Infineon Technologies AG Austria, Villach, Austria, persistent22
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398