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  Formation and Interface Structure of TiC Particles in Dispersion Strengthened Cu Alloys

Dehm, G., Thomas, J., Mayer, J., Weißgärber, T., Püsche, W., & Sauer, C. (1998). Formation and Interface Structure of TiC Particles in Dispersion Strengthened Cu Alloys. Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties, 77(6), 1531-1554. doi:10.1080/01418619808214268.

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 Creators:
Dehm, Gerhard1, 2, Author           
Thomas, Jörg3, Author           
Mayer, Joachim3, Author           
Weißgärber, Thomas4, Author           
Püsche, Wolfgang4, Author           
Sauer, Christa4, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Department of Materials Engineering, Technion - Israel Inst. of Technol., Haifa 32000, Israel, ou_persistent22              
3Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              
4Dresden University of Technology, Mommsenstr. 13, Dresden D-01062, Germany, persistent22              

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Language(s): eng - English
 Dates: 1998-06
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1080/01418619808214268
 Degree: -

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Title: Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
  Abbreviation : Philos. Mag. A
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: London, UK : Taylor & Francis
Pages: - Volume / Issue: 77 (6) Sequence Number: - Start / End Page: 1531 - 1554 Identifier: ISSN: 0141-8610
CoNE: https://pure.mpg.de/cone/journals/resource/111082135169000