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  High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

Sauer, C., Weißgärber, T., Püsche, W., Dehm, G., Mayer, J., & Kieback, B. F. (1997). High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys. International Journal of Powder Metallurgy, 33(1), 45-53.

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 Creators:
Sauer, Christa1, Author              
Weißgärber, Thomas1, Author              
Püsche, Wolfgang1, Author              
Dehm, Gerhard2, Author              
Mayer, Joachim3, Author              
Kieback, Bernd F.1, Author              
Affiliations:
1Dresden University of Technology, Mommsenstr. 13, Dresden D-01062, Germany, persistent22              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
3Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              

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Language(s): eng - English
 Dates: 1997-01
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: -
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Title: International Journal of Powder Metallurgy
  Abbreviation : Int. J. Powder Metallurg.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Princeton, NJ, USA : American Powder Metallurgy Institute International
Pages: - Volume / Issue: 33 (1) Sequence Number: - Start / End Page: 45 - 53 Identifier: ISSN: 0888-7462
CoNE: https://pure.mpg.de/cone/journals/resource/0888-7462