ausblenden:
Schlagwörter:
Copper Deposition | Cuprous Oxide | Polyimide Film | Interfacial Chemistry | Amic Acid
Zusammenfassung:
In this short overview the pertinent differences in the chemical interaction in differently prepared polyimide/metal interfaces are summarized. Considered are the cases of metals (Cr, Cu) deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto a bulk substrate and subsequent thermal imidization, vapor deposited polyamic acid on bulk substrates (Cu, Ag, Si, Cr) with subsequent thermal imidization, and deposition of polyamic acid in the form of mono- and multilayers by Langmuir-Blodgett (LB) techniques onto a Si (100) surface. New FTIR and XPS data are discussed for copper deposition onto polyimide.
