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  Comparison between the interfacial chemistry of metallized polyimides and polyimide films on bulk metal substrates

Grunze, M., Killinger, A., Thümmler, C., Hahn, C., & Strunskus, T. (1991). Comparison between the interfacial chemistry of metallized polyimides and polyimide films on bulk metal substrates. In K. L. Mittal (Ed.), Metallized Plastics 2: Fundamental and Applied Aspects (pp. 165-177). Boston, MA: Springer.

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Mittal_1990_MetallizedPlastics2_165.pdf (Any fulltext), 2MB
 
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 Creators:
Grunze, M.1, Author           
Killinger, A., Author
Thümmler, C., Author
Hahn, C., Author
Strunskus, T., Author
Affiliations:
1Cellular Biophysics, Max Planck Institute for Medical Research, Max Planck Society, ou_2364731              

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Free keywords: Copper Deposition | Cuprous Oxide | Polyimide Film | Interfacial Chemistry | Amic Acid
 Abstract: In this short overview the pertinent differences in the chemical interaction in differently prepared polyimide/metal interfaces are summarized. Considered are the cases of metals (Cr, Cu) deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto a bulk substrate and subsequent thermal imidization, vapor deposited polyamic acid on bulk substrates (Cu, Ag, Si, Cr) with subsequent thermal imidization, and deposition of polyamic acid in the form of mono- and multilayers by Langmuir-Blodgett (LB) techniques onto a Si (100) surface. New FTIR and XPS data are discussed for copper deposition onto polyimide.

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Language(s): eng - English
 Dates: 1991
 Publication Status: Issued
 Pages: 13
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1007/978-1-4899-0735-6_13
 Degree: -

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Title: Metallized Plastics 2 : Fundamental and Applied Aspects
Source Genre: Book
 Creator(s):
Mittal, Kashmiri Lal, Editor
Affiliations:
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Publ. Info: Boston, MA : Springer
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 165 - 177 Identifier: ISBN: 978-1-4899-0737-0
ISBN: 978-1-4899-0735-6