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  Orientation-dependent mechanical behaviour of electrodeposited copper with nanoscale twins

Mieszala, M., Guillonneau, G., Hasegawa, M., Raghavan, R., Wheeler, J. M., Mischler, S., et al. (2016). Orientation-dependent mechanical behaviour of electrodeposited copper with nanoscale twins. Nanoscale, 8(35), 15999-16004. doi:10.1039/c6nr05116b.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-B21C-7 Version Permalink: http://hdl.handle.net/21.11116/0000-0001-B21D-6
Genre: Journal Article

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Mieszala, Maxime1, Author              
Guillonneau, Gaylord2, 3, Author              
Hasegawa, Madoka1, Author              
Raghavan, Rejin4, Author              
Wheeler, Jeffrey M.5, 6, Author              
Mischler, Stefano7, Author              
Michler, Johann1, Author              
Philippe, Laätitia1, Author              
Affiliations:
1Empa – Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Thun, Switzerland, persistent22              
2Université de Lyon, Ecole Centrale de Lyon, Laboratoire de Tribologie et Dynamique des Systèmes, UMR CNRS 5513 ECL-ENISE-ENTPE, Ecully, France, persistent22              
3Laboratory for Mechanics of Materials and Nanostructures, Empa, Swiss Federal Laboratories for Materials Science and Technology, Thun, Switzerland, persistent22              
4Synthesis of Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863403              
5Laboratory for Nanometallurgy, Department of Materials Science, ETH Zürich, Zurich, Switzerland, ou_persistent22              
6Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, Switzerland, ou_persistent22              
7Tribology and Interface Chemistry Group, EPFL, Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland, persistent22              

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Free keywords: Copper; Copper metallography; Corrosion; Electrodeposition; Electrodes; Ion beams; Mechanical properties; Metallic films; Nanotechnology; Piles, Deformation mechanism; Electrodeposited copper; Mechanical behaviour; Micro compressions; Micro-pillar compressions; Orientation dependent; Strain sensitivity; Ultrafine-grained copper, Strain rate
 Abstract: The mechanical properties of electrodeposited copper with highly-oriented nanoscale twins were investigated by micropillar compression. Uniform nanotwinned copper films with preferred twin orientations, either vertical or horizontal, were obtained by controlling the plating conditions. In addition, an ultrafine grained copper film was synthesized to be used as a reference sample. The mechanical properties were assessed by in situ SEM microcompression of micropillars fabricated with a focused ion beam. Results show that the mechanical properties are highly sensitive to the twin orientation. When compared to the ultrafine grained sample, an increase of 44 and 130 in stress at 5 offset strain was observed in quasi-static tests for vertically and horizontally aligned twins, respectively. Inversely strain rate jump microcompression testing reveals higher strain sensitivity for vertical twins. These observations are attributed to a change in deformation mechanism from dislocation pile-ups at the twin boundary for horizontal twins to dislocations threading inside the twin lamella for vertical twins. © 2016 The Royal Society of Chemistry.

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Language(s): eng - English
 Dates: 2016-09-21
 Publication Status: Published in print
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 Rev. Method: Peer
 Identifiers: DOI: 10.1039/c6nr05116b
BibTex Citekey: Mieszala201615999
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Title: Nanoscale
Source Genre: Journal
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Publ. Info: Cambridge, UK : Royal Society of Chemistry
Pages: - Volume / Issue: 8 (35) Sequence Number: - Start / End Page: 15999 - 16004 Identifier: ISSN: 2040-3364
CoNE: /journals/resource/2040-3364