English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Electro-mechanical performance of thin gold films on polyimide

Putz, B., Glushko, O., Marx, V. M., Kirchlechner, C., Többens, D. M., & Cordill, M. J. (2016). Electro-mechanical performance of thin gold films on polyimide. In MRS Advances (pp. 773-778). Materials Research Society.

Item is

Basic

show hide
Item Permalink: http://hdl.handle.net/21.11116/0000-0001-B99A-1 Version Permalink: http://hdl.handle.net/21.11116/0000-0002-9E65-B
Genre: Conference Paper

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Putz, Barbara1, Author              
Glushko, Oleksandr1, Author              
Marx, Vera Maria2, Author              
Kirchlechner, Christoph3, 4, Author              
Többens, Daniel Maria5, Author              
Cordill, Megan Jo6, Author              
Affiliations:
1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben, Austria, ou_persistent22              
2Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399              
3Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              
4Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
5Helmholtz-Zentrum Berlin für Materialien und Energie, Albert-Einstein-Str. 15, 12489 Berlin, Germany, ou_persistent22              
6Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22              

Content

show
hide
Free keywords: Binary alloys; Chromium alloys; Cracks; Metallic films; Polyimides; Polymer films; Polymers; Strain; Substrates; Thin films; X ray diffraction, Electrical resistances; Electro-mechanical; Electronic technologies; Engineering strains; Flexible applications; In-situ measurement; Polyimide substrate; Polymer substrate, Gold
 Abstract: Thin metal films on compliant polymer substrates are of major interest for flexible electronic technologies. The suitability of a film system for flexible applications is based on the electro-mechanical performance of the metal film/polymer substrate couple. This study demonstrates how a 10 nm Cr interlayer deteriorates the electro-mechanical performance of 50 nm Au films on polyimide substrates by inducing the formation of cracks in the ductile layer. Combined in-situ measurements of the film lattice strains with x-ray diffraction and electrical resistance with four point probe of the Au-Cr and Au layers during uniaxial straining confirmed different electro-mechanical behaviours. For Au films with a Cr interlayer the film stress decreases rapidly as cracking initiates and reaches a plateau as the saturation crack spacing is reached. Crack formation and stress drop correspond to a rapid increase in the film resistance. Without the interlayer the Au film stress reaches a maximum around 2 engineering strain and remains constant throughout the experiment. The film resistance is unaffected by the applied elongation up to a maximum strain of 15, giving no sign of cracking in the metal layer. The outstanding electro-mechanical performance of the gold film indicates that adhesion layers, like Cr, may not be necessary to improve the performance of ductile films on polymers. © 2016 Materials Research Society.

Details

show
hide
Language(s): eng - English
 Dates: 2016
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: DOI: 10.1557/adv.2016.233
BibTex Citekey: Putz2016773
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: MRS Advances
Source Genre: Proceedings
 Creator(s):
Affiliations:
Publ. Info: Materials Research Society
Pages: - Volume / Issue: 1 (12) Sequence Number: - Start / End Page: 773 - 778 Identifier: ISSN: 20598521
CoNE: /journals/resource/20598521