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  Interfacial mutations in the Al-polyimide system

Putz, B., Milassin, G., Butenko, Y. V., Völker, B., Gammer, C., Semprimoschnig, C. O., et al. (2018). Interfacial mutations in the Al-polyimide system. Surface and Interface Analysis, 50(5), 579-586. doi:10.1002/sia.6434.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0001-E6E0-E Version Permalink: http://hdl.handle.net/21.11116/0000-0001-E6E2-C
Genre: Journal Article

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 Creators:
Putz, Barbara1, Author              
Milassin, G.2, Author              
Butenko, Yu V.2, Author              
Völker, Bernhard3, 4, 5, Author              
Gammer, Christoph1, Author              
Semprimoschnig, Christopher O.A.2, Author              
Cordill, Megan Jo6, 7, Author              
Affiliations:
1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben, Austria, persistent22              
2European Space Research and Technology Centre (ESTEC), Noordwijk, The Netherlands, persistent22              
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
4Materials Chemistry, RWTH Aachen University, Aachen, Germany, ou_persistent22              
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
6Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22              
7Department Materials Physics, Montanuniversitt Leoben, Jahnstrae 12, A-8700 Leoben, Austria, ou_persistent22              

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Free keywords: Aluminum; Flexible electronics; High resolution transmission electron microscopy; Interfaces (materials); Metal analysis; Metals; Polyimides; Polymers; Thermal insulation; Thermodynamic stability; Trace elements; Transmission electron microscopy, Amorphous interlayers; Cross sectional transmission electron microscopy; High-tech devices; Interface chemistry; Interfacial stabilities; Metal polymer interfaces; Metal-polymer composites; Thermal annealing treatment, X ray photoelectron spectroscopy
 Abstract: Understanding the thermal stability of metal-polymer interfaces is essential for the reliability of innovative high-tech devices, including flexible electronics or satellite insulation. In this study, the interfacial stability of aluminum-polyimide (Al-PI) is investigated as a function of thermal cycling (±150°C) and thermal annealing treatments (150°C-300°C) with X-ray photoelectron spectroscopy measurements performed after peeling and cross-sectional transmission electron microscopy analysis. Small mutations in the interface chemistry and structure were detected and identified after annealing at 225°C for 140 hours, including the thickness increase of an amorphous interlayer between Al and PI of about 2 nm and a change in the failure mechanism during the peeling. Being able to trace subcritical mutations before they become fatal is essential to predict the reliability and lifetime of metal-polymer composites. Copyright © 2018 John Wiley Sons, Ltd.

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Language(s): eng - English
 Dates: 2018-05
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: Peer
 Identifiers: DOI: 10.1002/sia.6434
BibTex Citekey: Putz2018579
 Degree: -

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Title: Surface and Interface Analysis
Source Genre: Journal
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Publ. Info: New York, NY : John Wiley & Sons
Pages: - Volume / Issue: 50 (5) Sequence Number: - Start / End Page: 579 - 586 Identifier: ISSN: 0142-2421
CoNE: https://pure.mpg.de/cone/journals/resource/954925471358