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  Coexistence of different atomic motifs in a <111> Cu tilt grain boundary resolved by STEM

Dehm, G. (2018). Coexistence of different atomic motifs in a <111> Cu tilt grain boundary resolved by STEM. Talk presented at 3rd Sino-German Symposium on Advanced Electron Microscopy of Interface Structures and Properties of Materials Tsinghua University. Beijing, China. 2018-09-24 - 2018-09-27.

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 Creators:
Dehm, Gerhard1, Author           
Affiliations:
1Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2018-09
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: -
 Degree: -

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Title: 3rd Sino-German Symposium on Advanced Electron Microscopy of Interface Structures and Properties of Materials Tsinghua University
Place of Event: Beijing, China
Start-/End Date: 2018-09-24 - 2018-09-27
Invited: Yes

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