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Is the Web Ready for OCSP Must-Staple?

Chung, T., Lok, J., Chandrasekaran, B., Choffnes, D., Levin, D., Maggs, B. M., et al. (2018). Is the Web Ready for OCSP Must-Staple? In IMC'18 (pp. 105-118). New York, NY: ACM. doi:10.1145/3278532.3278543.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0002-BF11-4 Version Permalink: https://hdl.handle.net/21.11116/0000-0002-BF13-2

Genre: Conference Paper

Latex : Is the Web Ready for {OCSP} Must-Staple?

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Creators:
Chung, Taejoong¹, Author
Lok, Jay¹, Author
Chandrasekaran, Balakrishnan², Author
Choffnes, David¹, Author
Levin, Dave¹, Author
Maggs, Bruce M.¹, Author
Mislove, Alan¹, Author
Rula, John¹, Author
Sullivan, Nick¹, Author
Wilson, Christo¹, Author

Affiliations:
1External Organizations, ou_persistent22
2Internet Architecture, MPI for Informatics, Max Planck Society, ou_2489697

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Language(s): eng - English

Dates: Published Online: 2018Date issued: 2018

Publication Status: Issued

Pages: -

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Table of Contents: -

Rev. Type: -

Identifiers: BibTex Citekey: Chung_IMC2018
DOI: 10.1145/3278532.3278543

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Title: Internet Measurement Conference

Place of Event: Boston, MA, USA

Start-/End Date: 2018-10-31 - 2018-11-02

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Title: IMC'18

Abbreviation : IMC 2018

Subtitle : Proceedings of the Internet Measurement Conference

Source Genre: Proceedings

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Publ. Info: New York, NY : ACM

Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 105 - 118 Identifier: ISBN: 978-1-4503-5619-0