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  Insight into the effect of Ti-addition on diffusion-controlled growth and texture of Nb3Sn intermetallic superconductor phase

Santra, S., Makineni, S. K., Shankar, G., Suwas, S., Chattopadhyay, K., Divinski, S. V., et al. (2019). Insight into the effect of Ti-addition on diffusion-controlled growth and texture of Nb3Sn intermetallic superconductor phase. Materialia, 6: 100276. doi:10.1016/j.mtla.2019.100276.

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Santra, Sangeeta1, 2, Author              
Makineni, Surendra Kumar3, 4, Author              
Shankar, Gyan1, Author              
Suwas, Satyam1, Author              
Chattopadhyay, Kamanio3, Author              
Divinski, Sergiy V.5, Author              
Paul, Aloke1, Author              
Affiliations:
1Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India, ou_persistent22              
2Department of Materials, University of Oxford, Oxford OX1 3PH, UK, ou_persistent22              
3Indian Institute of Science, Department of Materials Engineering, Bangalore, India, ou_persistent22              
4Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863384              
5Institute for Materials Physics, University of Münster, Münster, Germany, ou_persistent22              

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 Abstract: The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlled growth kinetics of Nb 3 Sn accompanied with a decrease in the activation energy in the Cu(5.5 at. Sn, Ti)/Nb and Cu(5.5 at. Sn)/Nb(Ti) diffusion couples. In either case, the β-(Ti,Nb) precipitates form at the grain boundaries of Nb 3 Sn. On the other hand, the ternary intermetallic phase, Nb 3 Sn 2 Ti 3 , is present in the interior of the Nb 3 Sn phase matrix only when Ti is added to Nb. The pinning forces on the grain boundaries of Nb 3 Sn exhorted by the β-(Ti,Nb) precipitates and related microstructure refinement results in an enhanced growth kinetics of the product phase, Nb 3 Sn. The addition of 0.5 at. Ti to Cu(Sn) has a stronger influence on the growth kinetics and the activation energy for the growth of Nb 3 Sn compared to 3 at. Ti to Nb owing to a higher fraction of smaller and equiaxed grains with high angle grain boundaries of Nb 3 Sn. The Ti-free Nb 3 Sn phase layer grows with a weak texture, a commonly observed behavior in other material systems for the product phases grown by diffusion-controlled mechanism in the interdiffusion zone. On the contrary, a very strong crystallographic texture of the Ti-containing product phase, Nb 3 Sn, is reported that has a unique pattern depending on the orientation of the adjacent Nb or Nb(Ti) grains. The Cu atoms segregate to the grain boundaries of Nb 3 Sn over a distance of ∼2–5 nm with a depletion of Nb. © 2019

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Language(s): eng - English
 Dates: 2019-06
 Publication Status: Published in print
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 Rev. Type: Peer
 Identifiers: DOI: 10.1016/j.mtla.2019.100276
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Title: Materialia
  Abbreviation : Materialia
Source Genre: Journal
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Publ. Info: Elsevier Ltd.
Pages: - Volume / Issue: 6 Sequence Number: 100276 Start / End Page: - Identifier: ISSN: 2589-1529
CoNE: https://pure.mpg.de/cone/journals/resource/2589-1529