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Abstract:
The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlled growth kinetics of Nb 3 Sn accompanied with a decrease in the activation energy in the Cu(5.5 at. Sn, Ti)/Nb and Cu(5.5 at. Sn)/Nb(Ti) diffusion couples. In either case, the β-(Ti,Nb) precipitates form at the grain boundaries of Nb 3 Sn. On the other hand, the ternary intermetallic phase, Nb 3 Sn 2 Ti 3 , is present in the interior of the Nb 3 Sn phase matrix only when Ti is added to Nb. The pinning forces on the grain boundaries of Nb 3 Sn exhorted by the β-(Ti,Nb) precipitates and related microstructure refinement results in an enhanced growth kinetics of the product phase, Nb 3 Sn. The addition of 0.5 at. Ti to Cu(Sn) has a stronger influence on the growth kinetics and the activation energy for the growth of Nb 3 Sn compared to 3 at. Ti to Nb owing to a higher fraction of smaller and equiaxed grains with high angle grain boundaries of Nb 3 Sn. The Ti-free Nb 3 Sn phase layer grows with a weak texture, a commonly observed behavior in other material systems for the product phases grown by diffusion-controlled mechanism in the interdiffusion zone. On the contrary, a very strong crystallographic texture of the Ti-containing product phase, Nb 3 Sn, is reported that has a unique pattern depending on the orientation of the adjacent Nb or Nb(Ti) grains. The Cu atoms segregate to the grain boundaries of Nb 3 Sn over a distance of ∼2–5 nm with a depletion of Nb. © 2019
