Density, distribution and nature of planar faults in silver antimony telluride 
for thermoelectric applications

Abdellaoui, Lamya; Zhang, Siyuan; Zaefferer, Stefan; Bueno Villoro, Ruben; Baranovskiy, Andrei; Cojocaru-Mirédin, Oana; Yu, Yuan; Amouyal, Yaron; Raabe, Dierk; Snyder, Gerald Jeffrey; Scheu, Christina

doi:10.1016/j.actamat.2019.07.031

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Density, distribution and nature of planar faults in silver antimony telluride for thermoelectric applications

Abdellaoui, L., Zhang, S., Zaefferer, S., Bueno Villoro, R., Baranovskiy, A., Cojocaru-Mirédin, O., et al. (2019). Density, distribution and nature of planar faults in silver antimony telluride for thermoelectric applications. Acta Materialia, 178, 135-145. doi:10.1016/j.actamat.2019.07.031.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0004-F6BD-2 Version Permalink: https://hdl.handle.net/21.11116/0000-0004-F6BE-1

Genre: Journal Article

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Creators:
Abdellaoui, Lamya¹, Author
Zhang, Siyuan¹, Author
Zaefferer, Stefan², Author
Bueno Villoro, Ruben¹, Author
Baranovskiy, Andrei³, Author
Cojocaru-Mirédin, Oana⁴, Author
Yu, Yuan⁵, Author
Amouyal, Yaron⁶, Author
Raabe, Dierk⁷, Author
Snyder, Gerald Jeffrey⁸, Author
Scheu, Christina¹, Author

Affiliations:
1Nanoanalytics and Interfaces, Independent Max Planck Research Groups, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_2054294
2Microscopy and Diffraction, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863391
3Department of Materials Science and Engineering, Technion–Israel Institute of Technology, Technion City, 32000, Haifa, Israel, ou_persistent22
4I. Physikalisches Institut (IA), RWTH Aachen, 52074 Aachen, Germany, ou_persistent22
5RWTH Aachen University, I. Physikalisches Institut IA, 52056 Aachen, Germany, ou_persistent22
6Technion, Israel Institute of Technology, Haifa, Israel, ou_persistent22
7Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381
8Northwestern University, Materials Science and Engineering Department, 2220 Campus Drive, Evanston, IL, 60208-3109, USA, ou_persistent22

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Language(s): eng - English

Dates: Published Online: 2019-07-23Date issued: 2019-10-01

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1016/j.actamat.2019.07.031

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Title: Acta Materialia

Abbreviation : Acta Mater.

Source Genre: Journal

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Pages: - Volume / Issue: 178 Sequence Number: - Start / End Page: 135 - 145 Identifier: ISSN: 1359-6454
CoNE: https://pure.mpg.de/cone/journals/resource/954928603100