Temperature dependent mechanical characterization of sputtered Copper-Silver 
thin film tensile specimens produced by photolithography

Arigela, Viswanadh Gowtham; Oellers, Tobias; Ludwig, Alfred; Kirchlechner, Christoph; Dehm, Gerhard

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Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography. Poster presented at Materials Chain International Conference, Bochum, Germany, Bochum, Germany.

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Datensatz-Permalink: https://hdl.handle.net/21.11116/0000-0005-470B-0 Versions-Permalink: https://hdl.handle.net/21.11116/0000-0005-470C-F

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Urheber:
Arigela, Viswanadh Gowtham¹, Autor
Oellers, Tobias², Autor
Ludwig, Alfred³, Autor
Kirchlechner, Christoph¹, Autor
Dehm, Gerhard⁴, Autor

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22
3Chair for MEMS Materials, Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany und Materials Research Department, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22
4Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398