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  Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

Du, C., Soler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., et al. (2019). Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia, 8: 100503. doi:10.1016/j.mtla.2019.100503.

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 Creators:
Du, Chaowei1, Author           
Soler, Rafael1, Author           
Völker, Bernhard2, 3, Author           
Matoy, Kurt4, Author           
Zechner, Johannes5, Author           
Langer, Gregor4, Author           
Reisinger, Michael5, Author           
Todt, Juraj6, Author           
Kirchlechner, Christoph1, Author           
Dehm, Gerhard2, Author           
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
3Materials Chemistry, RWTH Aachen University, Aachen, Germany, ou_persistent22              
4Infineon Technologies AG Austria, Villach, Austria, ou_persistent22              
5Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria, ou_persistent22              
6Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraße 12, Leoben, Austria, ou_persistent22              

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Language(s): eng - English
 Dates: 2019-10-102019-12
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: DOI: 10.1016/j.mtla.2019.100503
 Degree: -

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Title: Materialia
  Abbreviation : Materialia
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 8 Sequence Number: 100503 Start / End Page: - Identifier: ISSN: 2589-1529
CoNE: https://pure.mpg.de/cone/journals/resource/2589-1529